Cordierite has low thermal expansion and high thermal shock resistance, making it suitable for use as a refractory material. Cordierite can also be used as a material for electronic devices due to its excellent dielectric properties.
Attribute | Value |
---|---|
Material | Cordierite Ceramics |
Thermal conductivity | 1.3 W/m.k |
Thermal Shock Resistance | 250°C |
Volume Resistivity | >1012 ohm-cm |
OEM,ODM | Acceptable |
Origin | WUXI JIANGSU CHINA |
MOQ | 100 PCS |
Package | Carton |
Item | Test Condition | Unit & Symbol | Cordierite Ceramics |
---|---|---|---|
The main chemical ingredient | MgO, Al2O3, SiO2 | ||
Bulk Density | gm/cc | 2.6 | |
Maximum Use Temperature | 1400℃ | ||
Hardness | HV | 800 | |
Bending Strength | 20℃ | Kgf/cm2 | 900 |
Compressive Strength | 20℃ | Kgf/cm2 | 3500 |
Fracture Toughness | K(I c) | Mpa m1/2 | - |
Thermal expansion | 1X 10-6/℃ | ≤2.0 | |
Thermal conductivity | 25℃-30℃ | W/m.k | 1.3 |
Thermal Shock Resistance | Tc | ℃ | 250 |
Dielectricity constant | 1MHz.25℃ | 6 | |
Dielectric strength | ac-kV/mm (ac V/mil) | 10 | |
Volume Resistivity | 20℃ | ohm-cm | > 1012 |