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Atomic Layer Deposition ALD Equipment For Organic Electronic Packaging Industry
Atomic Layer Deposition ALD Equipment For Organic Electronic Packaging Industry
Specifications
Brand Name :
ZEIT
Model Number :
ALD-OEP-X—X
Certification :
Case by case
Place of Origin :
Chengdu, P.R.CHINA
MOQ :
1set
Price :
Case by case
Payment Terms :
T/T
Supply Ability :
Case by case
Delivery Time :
Case by case
Packaging Details :
Wooden case
Weight :
Customizable
Size :
Customizable
Guarantee period :
1 year or case by case
Customizable :
Available
Shipping Terms :
By Sea / Air / Multimodal Transport
Description

Atomic Layer Deposition in Organic Electronic Packaging Industry

Applications

Applications Specific Purpose

Organic electronic packaging

Packaging of organic light-emitting diode (OLED), etc.

Working Principle

The advantage of atomic layer deposition technology is that, because the surface reaction of ALD technology is

self-limiting, materials of the desired precise thickness can be made by repeating this self-limitation constantly.

This technology has good step coverage and large area of thickness uniformity. Continuous growth makes nano

film materials pinhole-free and high-density.

Features

Model ALD-OEP-X—X
Coating film system AL2O3, TiO2, ZnO, etc
Coating temperature range Normal temperature to 500℃ (Customizable)
Coating vacuum chamber size

Inner diameter: 1200mm, Height: 500mm (Customizable)
Vacuum chamber structure According to customer’s requirements
Background vacuum <5×10-7mbar
Coating thickness ≥0.15nm
Thickness control precision ±0.1nm
Coating size 200×200mm² / 400×400mm² / 1200×1200 mm², etc
Film thickness uniformity ≤±0.5%
Precursor and carrier gas

Trimethylaluminum, titanium tetrachloride, diethyl zinc, pure water,

nitrogen, etc.
Note: Customized production available.

Coating Samples

Atomic Layer Deposition ALD Equipment For Organic Electronic Packaging IndustryAtomic Layer Deposition ALD Equipment For Organic Electronic Packaging Industry

Process Steps
→ Place the substrate for coating into the vacuum chamber;
→ Vacuumize the vacuum chamber at high and low temperature, and rotate the substrate synchronously;
→ Start coating: the substrate is contacted with precursor in sequence and without simultaneous reaction;
→ Purge it with high-purity nitrogen gas after each reaction;
→ Stop rotating the substrate after the film thickness is up to standard and the operation of purging and cooling is

completed, then take out the substrate after the vacuum breaking conditions are met.

Our Advantages

We are manufacturer.

Mature process.

Reply within 24 working hours.

Our ISO Certification

Atomic Layer Deposition ALD Equipment For Organic Electronic Packaging Industry

Parts Of Our Patents

Atomic Layer Deposition ALD Equipment For Organic Electronic Packaging IndustryAtomic Layer Deposition ALD Equipment For Organic Electronic Packaging Industry

Parts Of Our Awards and Qualifications of R&D

Atomic Layer Deposition ALD Equipment For Organic Electronic Packaging IndustryAtomic Layer Deposition ALD Equipment For Organic Electronic Packaging Industry

Product tags

engineering plastic compounding

,

r&m materials handling

,

what is aluminium fabrication
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Atomic Layer Deposition ALD Equipment For Organic Electronic Packaging Industry

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Product Detail
Brand Name :
ZEIT
Model Number :
ALD-OEP-X—X
Certification :
Case by case
Place of Origin :
Chengdu, P.R.CHINA
MOQ :
1set
Price :
Case by case
Contact Supplier
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Atomic Layer Deposition ALD Equipment For Organic Electronic Packaging Industry

ZEIT Group

Active Member
4 Years
sichuan, chengdu
Since 2018
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Optical Coating Equipment, Optical Testing Equipment, Photomask Substrate
Total Annual :
＄10,000,000-＄15,000,000
Employee Number :
120~200
Certification Level :
Active Member
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