Automated 3D X-Ray Inspection System for PCBA Boards and Semiconductor Products
Desktop Scientific Research CT/3D System
Compact, high-precision inspection solution for analyzing internal structures of solder joints and semiconductor components.
Key Equipment Features
- Small footprint with high scanning accuracy
- Simple, intuitive operation
- Fully automated process: scanning, 3D reconstruction, and image analysis
- Space-efficient compact design
Inspection Applications
- Small-sized PCBA boards
- Internal structure quality of semiconductor packaging
- SMT solder joint quality assessment:
- Cold solder joints
- Wetting issues
- Solder volume analysis
- Component offset detection
- Foreign object identification
- Bridging detection
- Pin presence verification
Technical Specifications
Ray Source Parameters
| Type of ray tube |
Closed tube X-ray source |
| Tube voltage range (T-160) |
0-150KV |
Detector Parameters
| Detector type |
Amorphous silicon flat panel detector |
| Pixel size (T-160) |
139μm |
| Pixel matrix (T-160) |
1536x1536 |
Equipment Performance Parameters
| Maximum sample size (T-160) |
Diameter 500mm * Height 750mm |
| Maximum imaging area (T-160) |
Diameter 250mm * Height 160mm |
| JIMA card resolution |
3μm |
| Equipment weight (T-160) |
1.5T |
| Equipment dimensions (T-160) |
1850mm * 1300mm * 2100mm (L*W*H) |
| Imaging software system |
Integrated scanning imaging software, 3D image reconstruction software, 3D image measurement and analysis software, image database management software |