3D X-ray Inspection System
Detection Applications
- Large size PCBA board inspection
- Internal structural quality analysis of semiconductor packaging
- SMT welding quality assessment including:
- Open welding detection
- Infiltration analysis
- Solder amount measurement
- Offset detection
- Foreign body identification
- Bridge and pin inspection
Equipment Characteristics
- 2D/2.5D imaging with multi-axis linkage for ROI imaging
- Advanced imaging enhancement capabilities
- Automatic analysis and image analysis functions
- Scanning programming functionality
- Optional rotating disk imaging module for multi-angle observation
- 3D imaging for local devices on complete boards
- Turntable and cone-beam CT imaging options for small devices
Technical Specifications
| X-ray Source |
| X-ray Tube Type |
Closed-tube X-ray source |
| Tube voltage range |
20-160 KV |
| Detector Parameters |
| Detector type |
Amorphous silicon fat panel detector |
| Pixel size |
100 μm |
| Pixel matrix |
1536*1536 |
| Maximum possible sample size |
Flat test bench 580*530mm
Rotating test stand 300*300mm
Rollover test stand 250*300mm |
| Maximum imaging area |
Flat test bench 460*410mm
Rotating test stand 300*300mm
Rollover test stand 250*100mm |
| JIMA card resolution |
Standard 0.9μm, max 0.5μm |
| Equipment weight |
4T |
| Equipment size |
1800 mm*1800 mm*2300 mm (Length * width * height) |
| Imaging software system |
Integrated scanning imaging software
3D image reconstruction software
3D image measurement and analysis software
Image database management software |