Basic Parameters
Ray Source Parameters
| Type of ray tube |
Closed tube X-ray source |
| Tube voltage range (T-130) |
40-130 KV |
Detector Parameters
| Detector type |
Amorphous silicon flat panel detector |
| Pixel size (T-130) |
100μm |
| Pixel matrix (T-130) |
1536x1536 |
Equipment Performance Parameters
| Maximum sample size (T-130) |
Diameter: 300mm × Height: 320mm |
| Maximum imaging area (T-130) |
Diameter: 200mm × Height: 120mm |
| JIMA card resolution |
3μm |
| Equipment weight (T-130) |
1T |
| Equipment dimensions (T-130) |
2150mm × 900mm × 1750mm (L×W×H) |
Key Equipment Features
- Compact structure with minimal space requirements
- One-click full-process automation for data scanning, 3D reconstruction, and image analysis
- High precision scanning capabilities
Inspection Applications
- Small-sized PCBA boards
- Internal structure quality of semiconductor packaging products
- SMT solder joint quality inspection including:
- Cold solder joints
- Wetting issues
- Solder volume analysis
- Component offset detection
- Foreign object identification
- Bridging detection
- Pin presence verification
Imaging Software System
- Integrated scanning imaging software
- 3D image reconstruction software
- 3D image measurement and analysis software
- Image database management software