Ultra-Inline Equipment for Fast and Accurate Solder Joint Defect Analysis 3D X Ray Inspection
3D X Ray Inspection for Solder Joint Defects - Fast and Accurate Analysis with Ultra-Inline CT/3D Equipment
Detector Parameters
| Parameter |
Specification |
| Detector type |
Amorphous silicon flat panel detector |
| Pixel size |
49.8 μm |
| Pixel matrix |
2304×2813 |
| Effective imaging area |
115 mm×140 mm |
| Picture frame rate |
18 fps (1×1) |
Equipment Performance Parameters
| Parameter |
Specification |
| Maximum possible sample size |
750 mm×530 mm (Length x Width) |
| Maximum imaging area |
730 mm×510 mm (Length x Width) |
| JIMA card resolution |
4μm |
| Equipment weight |
5T |
| Equipment size |
2336 mm×2321 mm×2109 mm (Length × width × height) |
| Imaging software system |
A set of online plate CT imaging system, including integrated scanning, data analysis and other modules |
X-ray Source Parameters
| Parameter |
Specification |
| X-ray Tube Type |
Closed-tube X-ray source |
| Tube voltage range |
45-130 KV |
| Tube current range |
0-0.5 mA |
| Maximum operating power |
65W |
Ultra-Inline CT/3D Equipment Features
- Full 3D automatic imaging and analysis
- Applicable for both on-line inspection and off-line analysis
- Capable of achieving fast CT imaging, with the fastest local imaging time less than 3 seconds
- Solves the problem of solder joint defect inspection that cannot be achieved by traditional 2D and 2.5D equipment
- Can be connected to the user's database to directly import inspection results
Inspection Applications
- Large-sized PCBA boards
- The internal structure quality of semiconductor packaging products
- The welding quality of various types of SMT solder joints, including open soldering, wetting conditions, solder volume, offset, foreign objects, bridging, and the presence of pins