6-Layer HDI Antenna PCB: High-Frequency RF Signal Interconnect

Product Overview:

Our 6-layer HDI Antenna PCBs are precision-engineered for the demands of high-frequency wireless communication, including 5G, satellite positioning, and MIMO arrays. By integrating advanced 2+N+2 laser micro-via structures, we enable ultra-dense routing while maintaining dedicated shielding layers to eliminate signal crosstalk. These boards feature high-stability dielectric materials with low Dk/Df properties, ensuring maximum gain and minimal transmission loss. Designed for compact RF modules and telecommunications hardware, our HDI solution delivers the high-speed performance and signal purity essential for modern connected devices.

Key Selling Points:

• High Gain: Optimized 6-layer stack-up for maximum RF signal reach.

• Low Loss: High-frequency materials ensure minimal signal attenuation.

• Anti-Interference: Advanced HDI shielding for pure data transmission.

Engineering Support: DFM (Design for Manufacturing) check before production.

Testing: Flying Probe Test, Fixture Test, Impedance Control Test, Thermal Stress Test.

“ Instant PCB(1-38 layers)”--PCBgate

PCBgate is a professional PCB manufacturer providing high-quality printed circuit boards for global electronics industries.

We are capable of manufacturing a wide range of PCB types to meet different application requirements, including:FR-4 PCBs,ceramic PCBs,carbon oil PCBs,Aluminum PCBs,Flexible & Rigid-Flex PCBs.

We specialize in 6-layer HDI Antenna PCB manufacturing, providing the perfect balance between multi-band signal isolation and space efficiency. By using Laser Direct Imaging (LDI) and high-speed laser drilling, we achieve the precise registration required for your advanced RF impedance and phased-array designs.

This 6-layer structure is ideal for 5G base stations, satellite terminals, and smart IoT gateways. We ensure 100% E-test and AOI inspection to guarantee that every board meets the highest industrial standards for signal stability and performance.

We support HDI PCB prototypes, small-batch production, and mass production to meet different customer requirements, helping you accelerate your product's time-to-market.

Our PCB manufacturing capability includes:

• Fine Line Technology: Min. Trace/Space down to 0.075mm / 0.075mm

• Blind & Buried Vias: Professional via-in-pad and resin filling processes

• High-End Materials: High-TG, Low-Loss, and Halogen-free laminates

• Surface Finishes: ENIG, ENEPIG, and OSP for superior soldering

• Complex Stack-ups: Multilayer HDI integration up to 20+ layers

• Rigorous Testing: AOI, Micro-sectioning, and Impedance Control

Attention: pictures are for reference only. The specific products are subject to the original factory model.

Standard Packaging: Inner Vacuum Packaging + Outer Carbon Box.

Delivery Partners: EMS,DHL,SF-express, FedEx, UPS or Sea/Air Freight for bulk orders.

• 15 years of experience in PCB manufacturing.

• Advanced Equipment: Equipped with high-speed CNC drilling machines and AOI testing lines.

• Professional engineering support

• Fast prototype delivery

• Global customers from Europe, USA and Asia

• Own Global Supply System.

• Fast and safe way by EMS/DHL/SF-express/Fedex,etc.

• New styles updating everyday and MOQ for all the styles;

1. What's your MOQ and what is PCBgate's fastest delivery time?

A: Our MOQ is Minimum packaging quantity, please contact us for details. Sample to mass production all can be supported by PCBgate.

2. Which payment terms does PCBgate accept?

A:Advance T/T,Western Union,Paypal, L/C,Credit Card, Cheque,Money Gram and Others.

3.What files are required for PCB quotation?

A:Gerber files, PCB specifications and quantity.

4. How to test PCB boards?

A: AOI, Fly probe testing, Text fixture testing, FOC etc. For bare PCB.

Shipping Information

Welcome to send us your PCB Gerber files for quotation.

Our engineering team will respond within 24 hours.