1.Typical applications:

Primarily used for drying, debinding, and curing of electronic components in vacuum or controlled atmosphere environments.

Vacuum ovens are primarily designed for the low-temperature processing of electronic components under vacuum and protective atmospheres.

2.Parameter characteristics:

Model:​​ Vacuum Oven

​Key Features & Specifications​
​Primary Application: Designed for ​low-temperature processing of electronic components​ under ​vacuum or protective atmosphere.
​Chamber Dimensions: 500×700×550mm (W×H×D)
​Temperature Range:
​Max Temperature: 250°C
​Operating Temperature: RT ~ 200°C
​Heating System:
​Aluminum heating plates​ for uniform heat distribution
​Ceramic fiber insulation​ for high thermal efficiency
​Temperature Control:
​4-zone independent control​ (4 heating plates, individually regulated)
​Yamatake NX-D15 intelligent programmable temperature control module​ (Japan)
​Power Supply:
​380/220±10%V, 3-phase 5-wire, 50Hz​
​Power Consumption:
​Max Power: 4×1.5kW (6kW total)
​Weight: Approx. ​600kg​
​Applications​
​Electronics Manufacturing: Drying, curing, and annealing of ​PCBs, semiconductors, and sensitive electronic components.
​Materials Processing: Low-temperature heat treatment under ​inert gas or vacuum conditions.
​R&D & Laboratory Use: Precise thermal processing with ​multi-zone temperature control.
​Installation & Operation Notes​
Requires ​stable 3-phase power supply​ and proper grounding.
Suitable for ​cleanroom or controlled environments​ to prevent contamination.
​Multi-zone heating​ ensures uniform temperature distribution for large or batch-processed components.
This vacuum oven is ideal for industries requiring ​precise, low-temperature thermal processing​ with ​high uniformity and atmosphere control.

3.Delivery Checklist

4. Equipment Normal Operating Conditions
4.1 Environmental Conditions: Temperature 0~40°C, humidity ≤80% RH, no corrosive gases, no strong airflow disturbances.
4.2 Gas Supply Requirements:

High-purity nitrogen (process protective gas): Purity >99.999%, inlet pressure 0.1~0.2MPa.
Dry, clean, oil-free compressed air (purge gas): Inlet pressure 0.4~0.8MPa.
4.3 Ventilation System: Non-contact connection to user's exhaust system, exhaust capacity >10m³/h.
4.4 Floor Requirements: Level surface, minimal vibration, load-bearing capacity >200kg/m².
4.5 Power Supply: Capacity >8kVA, three-phase five-wire system, AC380V, 50Hz. Phase wires: Yellow, Green, Red; Neutral wire: Blue; Ground wire: Yellow-green.
4.6 Installation Space: 2000mm×2000mm×3000mm (Depth×Width×Height), installation area >4m².