Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.
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1 Years
hefei
Since 2021
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Supplier Homepage > Products > Copper Clad Polyimide Film

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PI Material

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Polyimide PI Film

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Polyimide Thin Film

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FPC Film

 (15)

Dielectric Film

 (13)

Transparent Polyimide Film

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Copper Clad Polyimide Film

 (11)

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Product Categories

Copper Clad Polyimide Film

11
Choose from our copper clad polyimide film products, find out more, and feel free to inquiry us
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Hot selling!
Copper Clad Polyimide Film

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Model：25um
MOQ：150kg
Contact Now
Engineered Copper-Polyimide Laminate for Flexible Circuits
Hot selling!
Copper Clad Polyimide Film

Engineered Copper-Polyimide Laminate for Flexible Circuits
Model：25um
MOQ：150kg
Contact Now
Polyimide-film-based, precision-laminated copper substrate for flexible circuits
Hot selling!
Copper Clad Polyimide Film

Polyimide-film-based, precision-laminated copper substrate for flexible circuits
Model：25um
MOQ：150kg
Contact Now
Advanced Copper-Polyimide Composite Structured Substrate
Copper Clad Polyimide Film

Advanced Copper-Polyimide Composite Structured Substrate
Model：25um
MOQ：150kg
Contact Now
RoHS General Copper Clad Polyimide Film Roll Yellow For Adhesive Tapes Heat Resistance
Copper Clad Polyimide Film

RoHS General Copper Clad Polyimide Film Roll Yellow For Adhesive Tapes Heat Resistance
Model：25um
MOQ：5kg
Contact Now
UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics
Copper Clad Polyimide Film

UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics
Model：25um
MOQ：150kg
Contact Now
Custom 50μM Copper Clad Polyimide Film Adhesive Substrate Anti Fog
Copper Clad Polyimide Film

Custom 50μM Copper Clad Polyimide Film Adhesive Substrate Anti Fog
Model：25um
MOQ：150kg
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High Temperature Flexible Circuit Colorless Polyimide Film Substrate Thin Film Material
Copper Clad Polyimide Film

High Temperature Flexible Circuit Colorless Polyimide Film Substrate Thin Film Material
Model：25um
MOQ：150kg
Contact Now
FPC Laminate Thermal Copper Clad Polyimide Film 75μM Customized In Bulk
Copper Clad Polyimide Film

FPC Laminate Thermal Copper Clad Polyimide Film 75μM Customized In Bulk
Model：25um
MOQ：150kg
Contact Now
ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging
Copper Clad Polyimide Film

ODM Polyimide Film Adhesive Substrate For Flexible Electronics Chip Packaging
Model：25um
MOQ：150kg
Contact Now
OEM Yellow Polyimide PI Heating Film Material Electrical Insulation FCCL Substrate
Copper Clad Polyimide Film

OEM Yellow Polyimide PI Heating Film Material Electrical Insulation FCCL Substrate
Model：12.5um
MOQ：5kg
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