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UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics
UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics
UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics
UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics
Specifications
Brand Name :
Guofeng
Model Number :
25um
Certification :
SGS Reach ROHS
Place of Origin :
China
MOQ :
150kg
Price :
$300-$30000
Payment Terms :
L/C,T/T
Supply Ability :
Negotiation
Delivery Time :
7 Working Days
Packaging Details :
Standard Packing
Material :
Polyimide
Elongation At Break :
50%
Thermal Expansion Coefficient :
20 ppm/°C
Operating Temperature :
-269°C to 260°C
Flammability :
UL 94 V-0
Dielectric Constant :
3.5
Description
Advanced Polyimide Nanocomposite Film for High-Density Flexible Electronics

Product Overview

This next-generation polyimide film substrate incorporates proprietary nanoparticle reinforcement to overcome traditional limitations in flexible electronics. With a 40% improvement in mechanical durability and 35% higher thermal conductivity compared to standard polyimide films, it enables thinner, more reliable, and thermally efficient flexible circuits. The material maintains excellent electrical insulation properties while providing unprecedented dimensional stability across a wide temperature range (-269°C to 400°C), making it ideal for advanced applications where conventional materials fail.

Place of Origin:
ANHUI, CHINA
Certification:
SGS, FDA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
5μm, 7.5μm, 11μm, 12.5μm, 25μm, 50μm, 70μm, 75μm, 100μm
Packaging:
Wooden pallet
Supply Ability:
2000 ton/year

Key Differentiators

  1. Enhanced Thermal Management

    • Thermal conductivity up to 0.8 W/m·K (2X conventional PI films)

    • Coefficient of thermal expansion (CTE) reduced to <10 ppm/°C (60% improvement)

  2. Superior Mechanical Performance

    • 40% higher tear resistance and 30% improved tensile strength

    • Withstands over 200,000 dynamic flex cycles at 3mm bend radius

  3. Advanced Processing Compatibility

    • Laser-drillable with 20μm microvias for HDI circuits

    • Compatible with thin-film transistor and semiconductor packaging processes

  4. Reliability in Extreme Conditions

    • Maintains performance after 1000 hours at 85°C/85% RH

    • UV laser processable for high-precision patterning

Applications

  • Flexible Displays: OLED substrate and touch sensor layers

  • Medical Electronics: Implantable devices and flexible sensors

  • Aerospace: Lightweight wiring systems and satellite components

  • Wearable Technology: Advanced biometric monitoring systems

  • Automotive: Flexible lighting systems and curved interior electronics

Why This Film?

This isn't just another polyimide film - it's a fundamentally advanced material platform enabling previously impossible flexible electronic designs. The combination of thermal, mechanical, and electrical properties creates new opportunities for innovation while providing unmatched reliability in demanding applications.

Product Images

UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible ElectronicsUL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics

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Product Detail
Brand Name :
Guofeng
Model Number :
25um
Certification :
SGS Reach ROHS
Place of Origin :
China
MOQ :
150kg
Price :
$300-$30000
Contact Supplier
UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics
UL 94 V-0 Advanced Copper Clad Polyimide Film Nanocomposite For Flexible Electronics

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Verified Supplier
1 Years
hefei
Since 2021
Business Type :
Manufacturer
Main Products :
PI Material, Polyimide PI Film, Polyimide Thin Film
Total Annual :
28000-50000
Employee Number :
100~300
Certification Level :
Verified Supplier
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