Copper-Laminated Polyimide Film (referred to as PI Copper Foil) is a premium-grade composite material tailor-made for flexible circuitry applications. It fuses high-grade pure copper foil with a polyimide (PI) base membrane via a high-precision laminating technique, incorporating the flexural resistance of flexible substrates and the electrical conductance of metallic conductors. Serving as a key foundational component for flexible electronic systems, it facilitates the achievement of "thin profile, lightweight design, bendability, and exceptional reliability."
Robust Mechanical Durabilit
Exceptional Dimensional Integrity
Excellent Lamination Performance
Compliant with RoHS and REACH

