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Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Specifications
Brand Name :
Guofeng
Model Number :
25um
Certification :
SGS Reach ROHS
Place of Origin :
China
MOQ :
150kg
Price :
$300-$30000
Payment Terms :
L/C,T/T
Supply Ability :
Negotiation
Delivery Time :
7 Working Days
Packaging Details :
Standard Packing
Cladding Material :
Copper
Surface Treatment :
Chemical Etching
Material :
Polyimide
Adhesive Type :
Acrylic
Description
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Product Overview:

The GL series represents a significant advancement in polyimide film technology. Utilizing our proprietary biaxial stretching process, we engineer a molecularly oriented structure that delivers a consistent 30% enhancement in key properties—including tensile strength, dimensional stability, and chemical resistance—compared to standard alternatives. This high-performance, natural yellow polyimide film is available in customized thicknesses and is the preferred material for demanding applications such as adhesive substrates and advanced chip packaging.

Place of Origin:
ANHUI, CHINA
Material:
Polyimide
Color:
Yellow
Treatment:
Single-side / Both Sides
Width:
514MM, 520MM, 1028MM, 1040MM
Thickness:
custom
Packaging:
vacuum packaging
Supply Ability:
2000 ton/year
Product Features:

Outstanding Mechanical Strength

Exceptional Dimensional Stability

Superior Laminating Properties

Conforms to RoHS and REACH regulations.


Product Applications:

The GL high-performance polyimide film is primarily used in:

High-precision adhesive FCCL substrates

High-stability cover films

Chip packaging

Special adhesive tape substrates


Handling & Storage Instructions:

To ensure the longevity and performance of our Polyimide film:

  • Shelf Life: 6 months from the date of manufacture
  • Storage Conditions:
    • Store in a cool, dry place away from direct sunlight
    • Avoid exposure to high humidity or extreme temperature fluctuations
Product Images:

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Company Image:

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

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Product Detail
Brand Name :
Guofeng
Model Number :
25um
Certification :
SGS Reach ROHS
Place of Origin :
China
MOQ :
150kg
Price :
$300-$30000
Contact Supplier
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry
Precision-Laminated Copper Polyimide Film Functional Substrate for Flex Circuitry

Hefei Guofeng Advanced Basic Materials Technology Co., Ltd.

Verified Supplier
1 Years
hefei
Since 2021
Business Type :
Manufacturer
Main Products :
PI Material, Polyimide PI Film, Polyimide Thin Film
Total Annual :
28000-50000
Employee Number :
100~300
Certification Level :
Verified Supplier
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