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8 Layer OSP Coating Black Communication PCB FR4 TG150 With 0.12mm Line Width
8 Layer OSP Coating Black Communication PCB FR4 TG150 With 0.12mm Line Width
Specifications
Material :
FR4 TG150
Minimum Hole Size :
0.2mm
Place of Origin :
China
Minimum Line Width :
0.1mm
Payment Terms :
Western Union
Layer Count :
8 L
Supply Ability :
1 Million Square feet/per month
Certification :
UL ,IOS9000
Delivery Time :
8-15DAYS
Brand Name :
XSW PCB
Price :
Negotiable
Board Thickness :
1.6mm
Model Number :
XSWPCB
MOQ :
1
Copper Thickness :
1/1/1/1 oz
Description
8-layer OSP Black Communication Module
High-performance 8-layer communication module featuring OSP surface finish and black solder mask, designed for reliable operation in communication applications.
Key Specifications
Parameter Specification
Layer Count 8 Layers
Material FR4 TG150
Board Thickness 1.2mm
Copper Thickness 1/0.5/0.5/1 oz
Minimum Hole Size 0.2mm
Minimum Line Width 0.12mm
Minimum Line Spacing 0.12mm
Solder Mask Color Black
Surface Finish OSP
Application Field Communication Module
Critical Production Processes
  • Vacuum lamination technology for inner layer pattern transfer to ensure tight adhesion and prevent bubble generation
  • Automated Optical Inspection (AOI) after inner layer etching to detect defects including undercuts, pinholes, and shorts
  • Strict control of temperature ramp rate (1.5-2.5°C/min) and pressure profile during lamination to prevent delamination
  • Coated drill bits for drilling process to reduce hole wall burrs, followed by desmearing and potassium permanganate cleaning
  • Plasma treatment before electroless copper deposition to improve hole wall roughness and adhesion
  • Backlight testing after copper deposition to ensure quality
  • Board brushing and sandblasting before solder mask spraying to improve ink adhesion
  • Parallel light exposure machine for solder mask exposure with energy uniformity ≥85%
  • Micro-etch roughening treatment before lead-free HASL with micro-etch depth of 1.5-2.5μm
  • Board baking (120°C/1h) to remove moisture and prevent solder splash
  • Controlled vertical board withdrawal speed during HASL for uniform tin layer thickness (±5μm)
  • Cooling and flattening after HASL with warpage inspection (≤0.75%)
  • 100% electrical testing using flying probe or universal fixture testing
Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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8 Layer OSP Coating Black Communication PCB FR4 TG150 With 0.12mm Line Width

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Product Detail
Material :
FR4 TG150
Minimum Hole Size :
0.2mm
Place of Origin :
China
Minimum Line Width :
0.1mm
Payment Terms :
Western Union
Layer Count :
8 L
Contact Supplier
8 Layer OSP Coating Black Communication PCB FR4 TG150 With 0.12mm Line Width

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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