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4 Layer Cell Phone Communication PCB Circuit Board FR4 TG170 With Immersion Gold
4 Layer Cell Phone Communication PCB Circuit Board FR4 TG170 With Immersion Gold
Specifications
Material :
FR4 TG170
Minimum Hole Size :
0.2 mm
Minimum Line Spacing :
0.1 mm
Payment Terms :
Western Union
MOQ :
1
Board Thickness :
1.2 mm
Copper Thickness :
1/1/1/1 oz
Place of Origin :
China
Price :
Negotiable
Minimum Line Width :
0.15 mm
Brand Name :
XSW PCB
Model Number :
XSWPCB
Certification :
UL ,IOS9000
Supply Ability :
1 Million Square feet/per month
Layer Count :
4
Delivery Time :
8-15DAYS
Description
4-layer immersion gold cell phone communication PCB

This product is specifically designed for communication mobile phones, aiming to provide a stable and reliable user experience as well as efficient application solutions.

Key Specifications
Layer Count 4
Material FR4 TG170
Board Thickness 1.2 mm
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.2 mm
Minimum Line Width 0.15 mm
Minimum Line Spacing 0.1 mm
Solder Mask Color Green
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Application Field Mobile Phone Communication
Product Description:
Strict Process Control (SPC): A statistical process control system is established for all key processes including lamination, etching, and immersion gold, with real-time monitoring of process parameters (CPK ≥ 1.33) to ensure production consistency and stability. Comprehensive Traceability System: Complete process data for each PCB board from raw materials to final shipment is recorded, including material batch numbers, equipment parameters, inspection results, etc., facilitating quality issue tracing and process improvement.
Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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4 Layer Cell Phone Communication PCB Circuit Board FR4 TG170 With Immersion Gold

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Product Detail
Material :
FR4 TG170
Minimum Hole Size :
0.2 mm
Minimum Line Spacing :
0.1 mm
Payment Terms :
Western Union
MOQ :
1
Board Thickness :
1.2 mm
Contact Supplier
4 Layer Cell Phone Communication PCB Circuit Board FR4 TG170 With Immersion Gold

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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