4-Layer Lead-Free HASL Communication Equipment Module
4-layer lead-free HASL communication equipment module designed for high-performance communication applications.
Key Specifications
| Parameter |
Specification |
| Layer Count |
4 Layers |
| Material |
FR4 TG150 |
| Board Thickness |
1.6mm |
| Copper Thickness |
1/1/1/1 oz |
| Minimum Hole Size |
0.2mm |
| Minimum Line Width |
0.15mm |
| Minimum Line Spacing |
0.12mm |
| Solder Mask Color |
White |
| Surface Finish |
HASL (Lead-Free) |
| Application Field |
Communication Module |
Technical Features
Material Selection & Characteristics
- High-Frequency Performance: Low dielectric constant materials reduce signal transmission loss
- High Reliability: Withstands complex outdoor environments including temperature/humidity changes and vibration
- Signal Integrity: High-purity copper foil with low surface roughness
Manufacturing Process
- High Precision: Laser Direct Imaging (LDI) technology for pattern transfer
- Layer-to-Layer Registration: CNC and laser drilling for microvias (0.05mm-0.15mm)
- Quality Control: Strict temperature and pressure profiles during lamination
Electrical Performance
- Impedance Control: ±5% or ±10% tolerance using TDR verification
- Signal Integrity: Guard routing and ground plane optimization
- EMC Compliance: Metal shielding for RF sections
Reliability Assurance
- Thermal Management: Thermal via arrays and copper heat-spreading channels
- Environmental Protection: Conformal coating for moisture, salt fog, and fungus protection
- Long-term Stability: IPC-6012 and IPC-6018 compliance
Technical Specifications
| Item |
Mass Production Capability |
Extreme Capability |
| Board Thickness Range |
0.3~6.0mm |
0.3~6.0mm |
| Exposure Alignment Accuracy |
±0.015mm |
±0.005mm |
| Minimum Annular Ring |
Single side ≥0.05mm |
Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) |
0.05mm / 0.05mm |
0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) |
0.05mm / 0.05mm |
0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) |
0.075mm / 0.075mm |
0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) |
±0.005mm |
±0.005mm |
| Etching Tolerance (1/2oz base copper) |
±0.005mm |
±0.005mm |
| Etching Tolerance (1oz base copper) |
±0.0075mm |
±0.0075mm |
| Gold Finger Total Pitch Tolerance |
<30mm: ±0.05mm
30~60mm: ±0.075mm |
<30mm: ±0.03mm
30~60mm: ±0.05mm |