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FR4 TG150 6 Layer ENIG PCB Board 0.1mm Line Width For Mobile Phone Modules
FR4 TG150 6 Layer ENIG PCB Board 0.1mm Line Width For Mobile Phone Modules
Specifications
Certification :
UL ,IOS9000
Material :
FR4 TG150
Minimum Hole Size :
0.2mm
Model Number :
XSWPCB
Delivery Time :
8-15DAYS
MOQ :
1
Place of Origin :
China
Board Thickness :
1.6mm
Brand Name :
XSW PCB
Copper Thickness :
1/1/1/1 oz
Payment Terms :
Western Union
Price :
Negotiable
Minimum Line Width :
0.1mm
Layer Count :
6 Layers
Supply Ability :
1 Million Square feet/per month
Description
6-layer ENIG Blue Mobile Phone Module
This advanced 6-layer mobile phone module features ENIG surface finish and blue solder mask, specifically designed for mobile communication applications with high-frequency performance requirements.
Key Specifications
Specification Value
Layer Count 6 Layers
Material FR4
Board Thickness 1.2mm
Copper Thickness 1/1/1/1 oz
Minimum Hole Size 0.2mm
Minimum Line Width 0.1mm
Minimum Line Spacing 0.1mm
Solder Mask Color Blue
Surface Finish ENIG
Application Field Mobile Communication
Critical Production Processes
  • Inner layer core board undergoes browning treatment for uniform film density
  • CCD automatic alignment exposure with ±25μm interlayer accuracy
  • 100% AOI inspection and line width measurement after inner layer etching
  • Hot oil press lamination with ±2°C temperature uniformity and vacuum assist
  • X-Ray measurement with ≤75μm interlayer misalignment control
  • Scanning acoustic microscopy for delamination and void detection
  • High-precision CNC drilling with backup board structures
  • Desmearing and potassium permanganate treatment before electroless copper
  • Vacuum screen printer for solder mask application
  • Plasma roughening before ENIG for enhanced adhesion
  • Comprehensive testing including tape pull, bend testing, and TDR impedance
Technical Specifications
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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FR4 TG150 6 Layer ENIG PCB Board 0.1mm Line Width For Mobile Phone Modules

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Product Detail
Certification :
UL ,IOS9000
Material :
FR4 TG150
Minimum Hole Size :
0.2mm
Model Number :
XSWPCB
Delivery Time :
8-15DAYS
MOQ :
1
Contact Supplier
FR4 TG150 6 Layer ENIG PCB Board 0.1mm Line Width For Mobile Phone Modules

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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