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6 Layer ENIG Communication Module PCB For High Frequency Signal Transmission
6 Layer ENIG Communication Module PCB For High Frequency Signal Transmission
Specifications
Material :
FR4 TG150
Minimum Hole Size :
0.2
Brand Name :
XSW PCB
Payment Terms :
Western Union
Certification :
UL ,IOS9000
Copper Thickness :
1/0.5/0.5/1 oz
Supply Ability :
1 Million Square feet/per month
Price :
Negotiable
Model Number :
XSWPCB
Board Thickness :
1.2mm
Minimum Line Width :
0.12mm
Place of Origin :
China
Delivery Time :
8-15DAYS
Layer Count :
6 L
MOQ :
1
Description
6-layer ENIG Communication Equipment Module
This high-performance 6-layer communication module is engineered for wireless base station applications, featuring advanced manufacturing processes and strict quality controls to ensure reliable high-frequency signal transmission.
Key Specifications
Layer Count 6 Layers
Material FR4 TG150
Board Thickness 1.2mm
Copper Thickness 1/0.5/0.5/1 oz
Minimum Hole Size 0.2mm
Minimum Line Width 0.12mm
Minimum Line Spacing 0.12mm
Solder Mask Color White
Surface Finish ENIG (Electroless Nickel Immersion Gold)
Application Field Communication Module
Manufacturing Process Highlights
  • LDI Pattern Transfer: Laser Direct Imaging ensures ±10% line width tolerance control
  • Vacuum Lamination: Eliminates dry film bubbles during production
  • AOI Inspection: Automated Optical Inspection detects undercuts and shorts post-etching
  • Precision Lamination: Controlled temperature ramp rate (1.5-2.5°C/min) prevents glass fiber slippage
  • Advanced Drilling: Coated drill bits with backup board structures minimize hole wall burrs
  • ENIG Finish: Plasma cleaning and micro-etching with nickel (3-6μm) and gold (0.05-0.1μm) layer control
  • 100% Electrical Testing: Flying probe or universal fixture testing ensures opens/shorts detection
Technical Capabilities
Item Mass Production Capability Extreme Capability
Board Thickness Range 0.3~6.0mm 0.3~6.0mm
Exposure Alignment Accuracy ±0.015mm ±0.005mm
Minimum Annular Ring Single side ≥0.05mm Single side ≥0.05mm
Min Line Width/Space (1/3oz base copper) 0.05mm / 0.05mm 0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper) 0.05mm / 0.05mm 0.05mm / 0.05mm
Min Line Width/Space (1oz base copper) 0.075mm / 0.075mm 0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1/2oz base copper) ±0.005mm ±0.005mm
Etching Tolerance (1oz base copper) ±0.0075mm ±0.0075mm
Gold Finger Total Pitch Tolerance <30mm: ±0.05mm
30~60mm: ±0.075mm		 <30mm: ±0.03mm
30~60mm: ±0.05mm
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6 Layer ENIG Communication Module PCB For High Frequency Signal Transmission

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Product Detail
Material :
FR4 TG150
Minimum Hole Size :
0.2
Brand Name :
XSW PCB
Payment Terms :
Western Union
Certification :
UL ,IOS9000
Copper Thickness :
1/0.5/0.5/1 oz
Contact Supplier
6 Layer ENIG Communication Module PCB For High Frequency Signal Transmission

Shenzhen Xunsiwei Circuit Co., Ltd.

Verified Supplier
1 Years
guangdong, shenzhen
Since 2009
Business Type :
Manufacturer
Main Products :
Single Layer Printed Circuit Board, Double Layer Printed Circuit Board, Multilayer Printed Circuit Board
Total Annual :
600 million-1000 million
Employee Number :
500~800
Certification Level :
Verified Supplier
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