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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System
High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System
High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System
High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System
Specifications
Model Number :
AX9500
MOQ :
1Set
Delivery Time :
30 days
Payment Terms :
T/T,L/C
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Brand Name :
UNICOMP
Packaging Details :
Wooden Case, Waterproof, Anti-collision
X-ray Leakage :
< 1uSv/h
Place of Origin :
China
Price :
can negotiate
Industry :
Electronics Industry
Supply Ability :
300 sets per month
Name :
Unicomp X-ray Inspection Machine
Certification :
CE, FDA
Description
High-definition FPD Detector BGA Head-In-Pillow Defect AX9500 Unicomp SMT Welding Analysis System
The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision CT inspection for accurate PCB and BGA analysis. This fully upgraded system performs comprehensive CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, plus SMT welding analysis with advanced 3D tomography CT scanning capabilities.
Applications
  • Semiconductor industry inspection
  • SMT welding analysis
  • Photovoltaic component testing
  • Ceramic products quality control
  • Automotive parts inspection
  • Aluminum die-casting mold castings
  • Molded plastic parts analysis
System Specifications
Footprint 1580(W) × 1860(D) × 2000(H) mm
Machine Weight ≈3750 kg
Power 4.5 kW
Max. Voltage 160 kV
X-Ray Leakage <0.5 μSv/h
Imaging System
Tube Type Open tube
Resolution 1 μm (Optional 0.5 μm)
Detector FPD
System Magnification 2000X
Inspection Area
Max. Inspection Dimension 610 × 540 mm
Max. Load Dimension 610 × 580 mm
Max. Inspection Area (3D) Planar 3D: 450(X) × 450(Y) mm
Cone-beam 3D: 50(D) × 150(L) mm
Motion Control Mode Joystick Mouse & Keyboard
Detector Angle 360° full viewing angle, 2 × 70 degree tilt
X-Ray Inspection Sample
High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System
* Specifications are subject to change without notice. All trademarks are the property of the system maker.
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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System

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Product Detail
Model Number :
AX9500
MOQ :
1Set
Delivery Time :
30 days
Payment Terms :
T/T,L/C
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Brand Name :
UNICOMP
Contact Supplier
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High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System
High‑definition FPD Detector BGA Head‑In‑Pillow Defect AX9500 Unicomp SMT Welding Analysis System

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
1000~1500
Certification Level :
Verified Supplier
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