AX9500 UNICOMP X-Ray Computed Tomography System
High-precision 2D/2.5D/3D all-in-one imaging system for accurate PCB and BGA inspection with 160kV open tube technology.
Advanced Inspection Capabilities
Fully upgraded system capable of CT detection on BGA, CSP, flip chips, LEDs and other semiconductors. Ideal for SMT welding analysis and 3D tomography CT scanning (planar CT + cone beam CT).
Industry Applications
- Semiconductor manufacturing
- SMT assembly processes
- Photovoltaic industry
- Ceramic products and specialized industries
- Automotive parts inspection
- Aluminum die-casting mold castings
- Molded plastic components
System Specifications
| System Summary |
| Footprint | 1580(W) × 1860(D) × 2000(H) mm |
| Machine Weight | ≈3750 kg |
| Power | 4.5 kW |
| Max. Voltage | 160 kV |
| X-Ray Leakage | <0.5 μSv/h |
| Imaging System |
| Tube Type | Open tube |
| Resolution | 1 μm (Optional 0.5 μm) |
| Detector | FPD |
| System Magnification | 2000X |
| Inspection Area |
| Max. Inspection Dimension | 610 × 540 mm |
| Max. Load Dimension | 610 × 580 mm |
| Max. Inspection Area (3D) | Planar 3D: 450(X) × 450(Y) mm Cone-beam 3D: 50(D) × 150(L) mm |
| Motion Control Mode | Joystick, Mouse & Keyboard |
| Detector Angle | 360° full viewing angle, 2×70 degree tilt |
X-Ray Inspection Sample
Specifications are subject to change without notice. All trademarks are the property of the system maker.