AX9500 UNICOMP 7-Axis 3D Reconstruction X-Ray Inspection Machine
High-precision CT system for accurate PCB and BGA inspection with advanced 3D tomography capabilities.
Advanced Inspection Capabilities
- CT detection for BGA, CSP, flip chips, LEDs and other semiconductors
- SMT welding analysis and quality control
- 3D tomography CT scanning system (planar CT + cone beam CT)
- 7-axis precision movement for comprehensive component inspection
Industry Applications
Widely used in semiconductor, SMT, photovoltaic, and ceramic product industries. Also suitable for automotive parts, aluminum die-casting mold castings, and molded plastic components inspection.
System Specifications
| System Summary |
| Footprint |
1580(W) × 1860(D) × 2000(H) mm |
| Machine Weight |
≈3750 kg |
| Power |
4.5 kW |
| Max. Voltage |
160 kV |
| X-Ray Leakage |
<0.5 μSv/h |
| Imaging System |
| Tube Type |
Open tube |
| Resolution |
1 μm (Optional 0.5 μm) |
| Detector |
FPD |
| System Magnification |
2000X |
| Inspection Area |
| Max. Inspection Dimension |
610 × 540 mm |
| Max. Load Dimension |
610 × 580 mm |
| Max. Inspection Area (3D) |
Planar 3D: 450(X) × 450(Y) mm Cone-beam 3D: 50(D) × 150(L) mm |
| Motion Control Mode |
Joystick Mouse & Keyboard |
| Detector Angle |
360° full viewing angle, 2 × 70 degree tilt |
Sample Inspection Image
Specifications are subject to change without notice. All trademarks are the property of the system maker.