Specifications
Model Number :
AX9500
MOQ :
1Set
Delivery Time :
30 days
Payment Terms :
T/T,L/C
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Brand Name :
UNICOMP
X-ray Leakage :
< 1uSv/h
Place of Origin :
China
Price :
can negotiate
Industry :
Electronics Industry
Supply Ability :
300 sets per month
Name :
Unicomp X-ray Inspection Machine
Certification :
CE, FDA
Description
AX9500 UNICOMP 7-Axis 3D Reconstruction X-Ray Inspection Machine
High-precision CT system for accurate PCB and BGA inspection with advanced 3D tomography capabilities.
Advanced Inspection Capabilities
  • CT detection for BGA, CSP, flip chips, LEDs and other semiconductors
  • SMT welding analysis and quality control
  • 3D tomography CT scanning system (planar CT + cone beam CT)
  • 7-axis precision movement for comprehensive component inspection
Industry Applications
Widely used in semiconductor, SMT, photovoltaic, and ceramic product industries. Also suitable for automotive parts, aluminum die-casting mold castings, and molded plastic components inspection.
System Specifications
System Summary
Footprint 1580(W) × 1860(D) × 2000(H) mm
Machine Weight ≈3750 kg
Power 4.5 kW
Max. Voltage 160 kV
X-Ray Leakage <0.5 μSv/h
Imaging System
Tube Type Open tube
Resolution 1 μm (Optional 0.5 μm)
Detector FPD
System Magnification 2000X
Inspection Area
Max. Inspection Dimension 610 × 540 mm
Max. Load Dimension 610 × 580 mm
Max. Inspection Area (3D) Planar 3D: 450(X) × 450(Y) mm
Cone-beam 3D: 50(D) × 150(L) mm
Motion Control Mode Joystick Mouse & Keyboard
Detector Angle 360° full viewing angle, 2 × 70 degree tilt
Sample Inspection Image
7‑axis 3D Reconstruction Reworked PCBA BGA X‑ray Inspection Machine AX9500 Unicomp
Specifications are subject to change without notice. All trademarks are the property of the system maker.
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7‑axis 3D Reconstruction Reworked PCBA BGA X‑ray Inspection Machine AX9500 Unicomp

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Model Number :
AX9500
MOQ :
1Set
Delivery Time :
30 days
Payment Terms :
T/T,L/C
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Contact Supplier
video
7‑axis 3D Reconstruction Reworked PCBA BGA X‑ray Inspection Machine AX9500 Unicomp
7‑axis 3D Reconstruction Reworked PCBA BGA X‑ray Inspection Machine AX9500 Unicomp

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Total Annual :
60 Million-100 Million
Employee Number :
1000~1500
Certification Level :
Verified Supplier
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