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Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester
Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester
Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester
Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester
Specifications
Payment Terms :
T/T,L/C
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Brand Name :
UNICOMP
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Model Number :
AX9500
MOQ :
1Set
Delivery Time :
30 days
Price :
can negotiate
Industry :
Electronics Industry
Certification :
CE, FDA
Supply Ability :
300 sets per month
Name :
Unicomp X-ray Inspection Machine
X-ray Leakage :
< 1uSv/h
Place of Origin :
China
Description
Multi-mode 3D Reconstruction PCBA BGA Solder Joint X-ray Inspection Machine AX9500 Unicomp Inspection Tester
High-precision CT machine AX9500 UNICOMP X-Ray Computed Tomography System for Accurate PCB and BGA Inspection
Product Overview
Fully upgraded new products featuring advanced CT detection capabilities for BGA, CSP, flip chips, LEDs and other semiconductors. Ideal for SMT welding analysis with comprehensive 3D tomography CT scanning system (planar CT + cone beam CT).
Applications
  • Semiconductor industry
  • SMT manufacturing
  • Photovoltaic components
  • Ceramic products and special industries
  • Automotive parts inspection
  • Aluminum die-casting mold castings
  • Molded plastic parts analysis
System Specifications
System Summary
Footprint 1580(W) × 1860(D) × 2000(H) mm
Machine Weight ≈3750 kg
Power 4.5 kW
Max. Voltage 160 kV
X-Ray Leakage <0.5 μSv/h
Imaging System
Tube Type Open tube
Resolution 1 μm (Optional 0.5 μm)
Detector FPD
System Magnification 2000X
Inspection Area
Max. Inspection Dimension 610 × 540 mm
Max. Load Dimension 610 × 580 mm
Max. Inspection Area (3D) Planer 3D: 450(X) × 450(Y) mm
Cone-beam 3D: 50(D) mm × 150(L) mm
Motion Control Mode Joystick Mouse & Keyboard
Detector Angle 360° full viewing angle, 2 × 70 degree tilt
X-Ray Inspection Sample
Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester
* Specifications are subject to change without notice. All trademarks are the property of the system maker.
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Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester

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Product Detail
Payment Terms :
T/T,L/C
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Brand Name :
UNICOMP
Packaging Details :
Wooden Case, Waterproof, Anti-collision
Model Number :
AX9500
MOQ :
1Set
Contact Supplier
video
Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester
Multi‑mode 3D Reconstruction PCBA BGA Solder Joint X‑ray Inspection Machine AX9500 Unicomp Inspection Tester

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
1000~1500
Certification Level :
Verified Supplier
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