MachineU > China Products > Machinery > Electronics Production Machinery
High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp
High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp
High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp
High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp
Specifications
Payment Terms :
T/T,L/C
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Brand Name :
UNICOMP
Model Number :
AX9500
Packaging Details :
Wooden Case, Waterproof, Anti-collision
MOQ :
1Set
Delivery Time :
30 days
Price :
can negotiate
Industry :
Electronics Industry
Supply Ability :
300 sets per month
Name :
Unicomp X-ray Inspection Machine
Certification :
CE, FDA
X-ray Leakage :
< 1uSv/h
Place of Origin :
China
Description
High-definition FPD SMT BGA Packaging X-ray Inspection Machine AX9500 Unicomp
The AX9500 UNICOMP X-Ray Computed Tomography System delivers high-precision inspection capabilities for accurate PCB and BGA analysis. This fully upgraded system performs CT detection on BGA, CSP, flip chips, LEDs, and other semiconductors, while also supporting SMT welding analysis with advanced 3D tomography CT scanning technology (planar CT + cone beam CT).
Applications
  • Semiconductor industry
  • SMT manufacturing
  • Photovoltaic components
  • Ceramic products
  • Automotive parts inspection
  • Aluminum die-casting mold castings
  • Molded plastic parts
System Specifications
Parameter Specification
Footprint 1580(W) × 1860(D) × 2000(H) mm
Machine Weight ≈3750 kg
Power 4.5 kW
Max. Voltage 160 kV
X-Ray Leakage <0.5 μSv/h
Imaging System
Parameter Specification
Tube Type Open tube
Resolution 1 μm (Optional 0.5 μm)
Detector FPD
System Magnification 2000X
Inspection Area
Parameter Specification
Max. Inspection Dimension 610 × 540 mm
Max. Load Dimension 610 × 580 mm
Max. Inspection Area (3D) Planar 3D: 450(X) × 450(Y) mm
Cone-beam 3D: 50(D) × 150(L) mm
Motion Control Mode Joystick Mouse & Keyboard
Detector Angle 360° full viewing angle, 2 × 70 degree tilt
X-Ray Inspection Sample
High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp
* Specifications are subject to change without notice. All trademarks are the property of the system maker.
Send your message to this supplier
Send Now

High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp

Ask Latest Price
Watch Video
Product Detail
Payment Terms :
T/T,L/C
Application :
SMT, EMS,BGA, Electronics, CSP , LED , Flip Chip , Semiconductor
Brand Name :
UNICOMP
Model Number :
AX9500
Packaging Details :
Wooden Case, Waterproof, Anti-collision
MOQ :
1Set
Contact Supplier
video
High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp
High‑definition FPD SMT BGA Packaging X‑ray Inspection Machine AX9500 Unicomp

Unicomp Technology

Verified Supplier
9 Years
guangdong, shenzhen
Since 2002
Business Type :
Manufacturer, Exporter, Seller
Main Products :
Air Freshener Dispenser, Hot Sales X Ray,
Total Annual :
60 Million-100 Million
Employee Number :
1000~1500
Certification Level :
Verified Supplier
Discover similar products
View More

Find Similar Products By Category:

Supplier Homepage Products
MachineU China Products Machinery Electronics Production Machinery
Contact Supplier
Submit Requirement