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ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices
ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices
Specifications
MOQ :
1
Price :
Inquiry Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
12 layers
Material :
Tg170
Board Thickness :
1.8mm
Construction :
3+4+3
Min. Line Width/Space :
0.1/0.1mm
Surface Treatment :
Immersion Gold
Color :
Green
Application :
Wearable Devices
Standard :
UL&IPC Standard &ISO
Description

Tg170 Multilayer Board(3+4+3) HDI PCB Wearable Devices

♦ What is HDI PCB?

HDI (High Density Interconnect) PCB is a high-density circuit board constructed by micro blind buried via technology, and uses a build-up process to achieve three-dimensional interconnection of inner and outer layer circuits. The core of its manufacturing lies in the use of laser drilling and electrochemical hole filling processes to form micron-level conductive paths between layers, so that each layer of circuit can be vertically connected without relying on traditional through holes. Ordinary HDI uses a single-layer structure, while high-end products are stacked through multiple layers, combined with advanced technologies such as stacked holes and laser direct forming, to further improve circuit density and electrical performance.

ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices

♦ Characteristics of HDI PCB

    • High circuit density
    • Miniaturization and thinness
    • Excellent signal integrity
    • Good heat dissipation performance
    • High reliability
    • A variety of laminate structures are available

♦ Applications of HDI PCB


Widely used in fields with high requirements on circuit board size, performance and reliability, such as smart phones, tablet computers, laptops, automotive electronics, medical equipment, aerospace, communication equipment, etc.

♦ Technical Parameters

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

♦ One-Stop PCBs Solution

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ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices
Heavy Copper PCB HDI PCB High Frequency PCB High TG PCB

♦ Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry；
    • Perfect after-sales service system；
    • From prototype to mass production

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ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices

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Product Detail
MOQ :
1
Price :
Inquiry Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
12 layers
Material :
Tg170
Contact Supplier
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ODM Multilayer FR4 Tg170 PCB Circuit Board For Wearable Devices

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Main Products :
PCB Manufacturing, PCB Prototype, SMT Assembly
Employee Number :
>800
Certification Level :
Verified Supplier
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