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High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones
High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones
Specifications
MOQ :
1
Price :
Contact Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
10 layers
Material :
Fr4
Thickness :
2.0 mm
Construction :
2+N+2
Min. Line Width/Space :
0.1/0.1mm
Surface Treatment :
Immersion Gold
Type :
Customizable
Application :
Electronic Product
Standard :
UL&IPC Standard &ISO
Description

12 Layer 3OZ High Density Interconnect HDI PCB

♦ What is High Density PCB (HDI PCB)?

A ​​High Density Interconnect (HDI) PCB​​ is an advanced printed circuit board designed to accommodate ​​more components in a smaller space​​ by using ​​finer traces, smaller vias, and higher connection density​​ than traditional PCBs. HDI technology enables ​​miniaturization, improved signal integrity, and enhanced performance​​ in modern electronics.

High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

♦ ​​​​Key Features of HDI PCBs​​​:

✅ ​​Finer Trace Width/Spacing​​ (≤ 100µm, vs. standard 150µm+).

✅ ​​​Microvias​​ (laser-drilled, < 150µm diameter) for high-density interconnects.

✅ ​​​​Blind & Buried Vias​​ (instead of through-hole vias) to save space.

✅ ​​Thinner Dielectric Materials​​ (for compact layer stacking).

✅ ​​Higher Layer Count​​ (often 8+ layers in a slim profile).

✅ ​​​Advanced Materials​​ (low-loss dielectrics for high-speed signals).

♦ ​​HDI PCB vs. Standard PCB: Key Differences​​?​

Feature ​​HDI PCB​​ ​​Standard PCB​​
​​Trace Width​​ ≤ 100µm (can go down to 40µm) ≥ 150µm
​​Via Size​​ Microvias (50–150µm) Through-hole vias (≥ 300µm)
​​Via Types​​ Blind, buried, stacked Mostly through-hole
​​Layer Count​​ 8+ (with thin dielectrics) Typically 2–12 layers
​​Signal Speed​​ Optimized for high-speed signals Limited high-speed performance
​​Applications​​ Smartphones, wearables, aerospace Consumer electronics, power circuits

♦ ​​​​Types of HDI PCBs​​​​:

    1. ​​1+N+1​​ – Single HDI layer (microvias on outer layers).
    2. ​​2+N+2​​ – Two HDI layers (stacked microvias).
    3. ​​3+N+3​​ – Three or more HDI layers (ultra-high density, used in advanced chips).
    4. ​​Any-Layer HDI​​ – Microvias can be placed anywhere (used in smartphones like iPhones).

♦ Technical Parameters

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

♦ One-Stop PCBs Solution

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♦ Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

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High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

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Product Detail
MOQ :
1
Price :
Contact Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
10 layers
Material :
Fr4
Contact Supplier
High Density Interconnect HDI PCB Fabrication 3OZ 12 Layer for Smartphones

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Main Products :
PCB Manufacturing, PCB Prototype, SMT Assembly
Employee Number :
>800
Certification Level :
Verified Supplier
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