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Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product
Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product
Specifications
MOQ :
1
Price :
Contact Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
16 layers
Material :
Fr4
Thickness :
3.0 mm
Construction :
4+N+4
Min. Line Width/Space :
0.1/0.1mm
Surface Treatment :
Immersion Gold
Type :
Customizable
Application :
Electronic Product
Standard :
UL&IPC Standard &ISO
Description

16 Layer Immersion Gold HDI PCB for Electronic Product

♦ What is Immersion Gold?

​​Immersion Gold​​ (also known as ​​ENIG – Electroless Nickel Immersion Gold​​) is a ​​surface finish​​ applied to ​​printed circuit boards (PCBs)​​ to protect exposed copper pads and ensure reliable solder connections. It consists of two layers:

    1. ​​Electroless Nickel (Ni)​​ – A thin (3–6µm) nickel-phosphorus layer deposited chemically (without electricity) to act as a barrier, preventing copper diffusion.
    2. ​​Immersion Gold (Au)​​ – A very thin (0.05–0.1µm) gold layer plated over the nickel to prevent oxidation and enhance solderability.

Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

♦ ​​Key Characteristics of Immersion Gold (ENIG):

✔ ​​Flat Surface​​ – Ideal for fine-pitch components (e.g., BGAs, QFNs).
✔ ​​Excellent Solderability​​ – Ensures strong, reliable solder joints.
✔ ​​Long Shelf Life​​ – Resists oxidation better than bare copper or OSP.
✔ ​​Wire-Bondable​​ – Suitable for gold or aluminum wire bonding (used in IC packaging).
✔ ​​Lead-Free & RoHS Compliant​​ – Environmentally friendly compared to HASL (lead-based).

♦ Comparison with Other PCB Finishes?​

Finish Thickness Flatness Solderability Cost Best For
​​ENIG​​ (Immersion Gold) Thin Au (0.05–0.1µm) Very Flat Excellent Moderate High-reliability, fine-pitch
​​HASL​​ (Hot Air Solder Leveling) Thick Sn/Pb or Sn Uneven Good Low General-purpose PCBs
​​OSP​​ (Organic Solderability Preservative) Organic coating Flat Good (but degrades over time) Low Short-life consumer electronics
​​Electrolytic Hard Gold​​ Thick Au (0.5–1.5µm) Flat Good (but requires nickel underlayer) High Connectors, wear-resistant parts

♦ Technical Parameters

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

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♦ Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

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Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

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Product Detail
MOQ :
1
Price :
Contact Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
16 layers
Material :
Fr4
Contact Supplier
Immersion Gold ENIG Rohs HDI Multilayer PCB 16 Layer For Electronic Product

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Main Products :
PCB Manufacturing, PCB Prototype, SMT Assembly
Employee Number :
>800
Certification Level :
Verified Supplier
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