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Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger
Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger
Specifications
MOQ :
1
Price :
Contact Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
8 layers
Material :
Rogers
Thickness :
2.0 mm
Construction :
2+N+2
Min. Line Width/Space :
0.1/0.1mm
Surface Treatment :
Immersion Gold
Type :
Customizable
Application :
Communication Electronics
Standard :
UL&IPC Standard &ISO
Description

8 Layer Rogers HDI Printed Circuit Board for Communication Electronics

♦ What is Printed Circuit Board?

A ​​Printed Circuit Board (PCB)​​ is a flat, rigid or flexible board made of insulating material (like fiberglass or plastic) with conductive pathways (traces) etched or printed onto its surface. These pathways connect electronic components (resistors, capacitors, ICs, etc.) to form a functional circuit.

Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger

♦ Key Parts of a PCB:​

    1. ​​Substrate (Base Material)​​

      • Usually made of ​​FR-4​​ (fiberglass-reinforced epoxy), but can also be polyimide (for flexible PCBs) or ceramic (for high-frequency applications).
      • Provides mechanical support and insulation.

    2. ​​Copper Layer​​

      • Thin sheets of copper are laminated onto the substrate to form conductive ​​traces​​ (wires) that carry electrical signals.

    3. ​​Solder Mask​​

      • A protective layer (usually green, blue, or red) that covers the copper to prevent short circuits and oxidation.

    4. ​​Silkscreen​​

      • White or black markings (text, symbols) printed on the PCB to label components, test points, or logos.

    5. ​​Pads & Vias​​

      • ​​Pads​​: Metal areas where components are soldered.
      • ​​Vias​​: Small holes plated with copper to connect traces between different layers (in multi-layer PCBs).

♦ Types of PCBs:?​

    • ​​Single-Layer PCB​​: Simplest type, with copper traces on one side.
    • ​​Double-Layer PCB​​: Traces on both sides, connected by vias.
    • ​​Multi-Layer PCB​​: 4+ layers (common in computers, smartphones).
    • ​​Flexible PCB (FPCB)​​: Made of bendable materials (e.g., polyimide).
    • ​​Rigid-Flex PCB​​: Combines rigid and flexible sections.

♦ Technical Parameters

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

♦ One-Stop PCBs Solution

Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger
PCB Prototype Felx PCB Rigid-Flex PCB Ceramic PCB
Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger
Heavy Copper PCB HDI PCB High Frequency PCB High TG PCB

♦ Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

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Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger

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Product Detail
MOQ :
1
Price :
Contact Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
8 layers
Material :
Rogers
Contact Supplier
Rogers High Density Interconnect HDI PCB Printed Circuit Board 8 Layer For Wireless Charger

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Main Products :
PCB Manufacturing, PCB Prototype, SMT Assembly
Employee Number :
>800
Certification Level :
Verified Supplier
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