Specifications
MOQ :
1
Price :
Contact Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
12 layers
Material :
Fr4
Thickness :
2.0 mm
Construction :
3+N+3
Min. Line Width/Space :
0.1/0.1mm
Surface Treatment :
Immersion Gold
Type :
Customizable
Application :
Medical Device
Standard :
UL&IPC Standard &ISO
Description

12 Layer Blind Hole HDI PCB for Medical Device

♦ What ​​is Blind Hole in PCBs:?

A ​​blind hole​​ (or ​​blind via​​) is a type of ​​PCB via​​ that connects an ​​outer layer to one or more inner layers​​ but does ​​not go through the entire board​​ (unlike a through-hole via).

​​Key Characteristics:​​

✔ ​​Starts from the surface​​ and ends at an internal layer.
✔ ​​Not visible from the opposite side​​ of the PCB.
✔ ​​Used in HDI (High-Density Interconnect) PCBs​​ to save space.
✔ ​​Laser-drilled​​ (typical diameter: 50–150µm).

12 Layer Blind Hole Fast Turn HDI PCB Electronics Manufacturing Assembly For Medical Device 12 Layer Blind Hole Fast Turn HDI PCB Electronics Manufacturing Assembly For Medical Device 12 Layer Blind Hole Fast Turn HDI PCB Electronics Manufacturing Assembly For Medical Device

♦ ​​Blind Hole vs. Other PCB Vias​​​?​

​Feature​ ​Blind Hole​ ​Buried Hole​ ​Through-Hole​
​Visibility​ Only on one side Fully internal Both sides
​Depth​ Outer → Inner layer Inner → Inner layer Top → Bottom
​Manufacturing​ Laser-drilled Mechanically drilled before lamination Mechanically drilled
​Cost​ Moderate (HDI PCBs) High (complex process) Low (standard PCBs)
​Usage​ Smartphones, wearables High-layer-count PCBs General-purpose PCBs

♦ ​​Why Use Blind Holes?​​

  1. ​​Space Saving​​ – Allows more routing in compact designs (e.g., smartphones).
  2. ​​Improved Signal Integrity​​ – Reduces stub effects in high-speed circuits.
  3. ​​Higher Layer Utilization​​ – Enables complex multilayer PCBs (e.g., 10+ layers).
  4. ​​Better Thermal Management​​ – Shorter paths reduce heat buildup.

Technical Parameters

Item

Spec

Layers

1~64

Board Thickness

0.1mm-10 mm

Material

FR-4, CEM-1/CEM-3, PI, High Tg, Rogers, PTEF, Alu/Cu Base,Ceramic, etc

Max Panel Size

800mm×1200mm

Min Hole Size

0.075mm

Min Line Width/Space

Standard: 3mil(0.075mm) Advance: 2mil

Board Outline Tolerance

士0.10mm

Insulation Layer Thickness

0.075mm--5.00mm

Out Layer Copper Thickness

18um--350um

Drilling Hole (Mechanical)

17um--175um

Finish Hole (Mechanical)

17um--175um

Diameter Tolerance (Mechanical)

0.05mm

Registration (Mechanical)

0.075mm

Aspect Ratio

17:01

Solder Mask Type

LPI

SMT Min. Solder Mask Width

0.075mm

Min. Solder Mask Clearance

0.05mm

Plug Hole Diameter

0.25mm--0.60mm

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Advantages of DQS Team
  1. On-time Delivery:
    • Owned PCBA factories 15,000 ㎡
    • 13 fully automatic SMT lines
    • 4 DIP assembly lines

2. Quality Guaranteed:

    • IATF, ISO, IPC, UL standards
    • Online SPI, AOI, X-Ray Inspection
    • The qualified rate of products reach 99.9%

3. Premium Service:

    • 24H reply your inquiry
    • Perfect after-sales service system
    • From prototype to mass production

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12 Layer Blind Hole Fast Turn HDI PCB Electronics Manufacturing Assembly For Medical Device

Ask Latest Price
MOQ :
1
Price :
Contact Us
Payment Terms :
T/T
Supply Ability :
200,000+ m² PCB per Month
Layer :
12 layers
Material :
Fr4
Contact Supplier
12 Layer Blind Hole Fast Turn HDI PCB Electronics Manufacturing Assembly For Medical Device

DQS Electronic Co., Limited

Verified Supplier
1 Years
shenzhen
Business Type :
Manufacturer
Employee Number :
>800
Certification Level :
Verified Supplier

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