The product features high density, lightweight design, and miniaturization, enabling reliable interconnections between internal system cables, between cables and printed circuits boards (PCBs), and between PCBs themselves within the electrical circuit system.
The product can withstand harsh environments such as strong vibration and shock, and is especially suitable for applications with special requirements for space and equipment lightweighting.
The contact-to-wire connection method of the product is crimp type.
Classified into three types according to PCB grid spacing (column spacing * row spacing):
Classified into two types according to PCB grid spacing (column spacing * row spacing):
| Operating temperature | -55℃ to +125℃ |
| Relative humidity | up to 95% at 40℃ |
| Rated operating current | 3 A |
| Contact resistance | ≤ 10 mΩ |
| Insulation resistance | ≥ 5000 MΩ at room temperature |
| Withstand voltage | 800 V at room temperature |
| Vibration | frequency 10–2000 Hz, acceleration 196 m/s² |
| Shock |
acceleration 735 m/s², 11 ms |
| Mechanical life | 500 cycles |
