Specifications
Brand Name :
JBNR
Model Number :
50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin :
CHINA
MOQ :
Negotiation
Price :
Negotiable
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
25days
Packaging Details :
as customer required
Material :
Molybdenum copper
Density :
9.8
CTE :
7.3
TC :
190-200
Description

Polished Molybdenum Copper Wafer / Disk Mo70Cu30 Heat Sink

Description:

Mo-Cu heat sink material is a composite of molybdenum and copper, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

Advantages:

1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product picture:

Mo - Cu Mo70Cu30 Heat Sink Polished Molybdenum And Copper Wafer / Disk

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Mo - Cu Mo70Cu30 Heat Sink Polished Molybdenum And Copper Wafer / Disk

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Brand Name :
JBNR
Model Number :
50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin :
CHINA
MOQ :
Negotiation
Price :
Negotiable
Payment Terms :
L/C, , T/T, Western Union
Contact Supplier
Mo - Cu Mo70Cu30 Heat Sink Polished Molybdenum And Copper Wafer / Disk

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
8 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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