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WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish
WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish
Specifications
Brand Name :
JBNR
Model Number :
50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin :
CHINA
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
MOQ :
Negotiation
Price :
Negotiable
Material :
tungsten copper
Density :
16.4
CTE :
7.2
TC :
185
Application :
Electronic Packaging
Description

WCu / MoCu / CMC / CPC Heat Sink Materials For Electronic Packaging

Description:

CuW heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.

CuMo composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.

CMC or CPC is a sandwich composite, CMC including a molybdenum core layer and two copper clad layers, CPC including a Mo-Cu alloy core layer and two copper clad layers . They have different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu.

Advantages:

1. High thermal conductivity

2. Excellent hermeticity

3. Excellent flatness, surface finish, and size control

4. Semi-finished or finished (Ni/Au plated) products available

5. Low void

Product Properties:

Grade W Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃) / 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)
Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Coefficient of thermal

Expansion ×10-6 (20℃)
CPC141 9.5 7.3 280(XY)/170(Z)
CPC232 9.3 10.2 255(XY)/250(Z)

Application:

These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product picture:

WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish

Product tags

heat sink profiles aluminium

,

standard double glazed unit thickness

,

aluminium heat sink profiles
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WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish

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Product Detail
Brand Name :
JBNR
Model Number :
50MoCu,60MoCu,70MoCu,85MoCu
Place of Origin :
CHINA
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
Contact Supplier
WCu MoCu CMC CPC Heat Sink Materials Excellent Flatness With Perfect Surface Finish

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
8 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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