Specifications
Brand Name :
JBNR
Model Number :
CPC141,CPC232,CPC300
Place of Origin :
CHINA
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
MOQ :
Negotiation
Price :
Negotiable
Material :
copper/moly copper/copper
Density :
9.5
CTE :
7.6
TC :
200
Application :
power device packages
Description

CPC141 Carrier / Base / Heat Sink For Powder Device Packages


Description:

Has the same thermal expansion coefficient as that of alumina ceramic, widely used for ceramic package using alumina. As the surface is copper with high thermal conductivity, it has excellent heat diffusion.

Advantages:

1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost
4.No magnetism

Product Properties:
Grade Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

Coefficient of thermal

Expansion ×10-6 (20℃)

CPC141 9.5 7.3

280(XY)/170(Z)

CPC232 9.3 10.2 255(XY)/250(Z)

Application:

Wireless communication, Opto electronics, in-vehicle, wind power generation, LED, industrial machine.

Product picture:

CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages

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CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages

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Brand Name :
JBNR
Model Number :
CPC141,CPC232,CPC300
Place of Origin :
CHINA
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
Contact Supplier
CPC141 Carrier Base Heat Sink Strong Interface Bonding For Powder Device Packages

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
8 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
Contact Supplier
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