No Magnetism CPC Heat Sink Flange , Copper Heat Sink For RF Power Device Package
Description:
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 | 280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount.
Product picture: