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85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging
85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging
85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging
85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging
Specifications
Brand Name :
JBNR
Model Number :
50WCu,75WCu,80WCu,85WCu,90WCu
Place of Origin :
CHINA
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
MOQ :
Negotiation
Price :
Negotiable
Material :
tungsten copper
Density :
16.4
CTE :
7.2
TC :
183
Application :
electronic packaging
Description

85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging

Description:

Electronic packaging is to put a certain function of the integrated circuit chips (including semiconductor integrated circuit chips, thin film integrated circuit substrate, hybrid integrated circuit chips) placed in a corresponding shell container, which can provide a stable environment to protect chips work normally and keep stable functions in integrated circuit. At the same time, encapsulation also is connection method of outputting and inputting to make the transition to outside, and it can form a completed entirety with chips.

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape.


Advantages:

1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void

Product Properties:

Grade W Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃) / 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)



Application:

These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts. etc.

Product picture:

85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging

Product tags

heatsink aluminum extrusion

,

extruded aluminum heatsinks

,

aluminum heatsink extrusions
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85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging

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Product Detail
Brand Name :
JBNR
Model Number :
50WCu,75WCu,80WCu,85WCu,90WCu
Place of Origin :
CHINA
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
Contact Supplier
85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging
85WCu Copper Tungsten Alloy , No Void Heat Spreader For Electronic Packaging

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
8 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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