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Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink
Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink
Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink
Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink
Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink
Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink
Specifications
Brand Name :
JBNR
Model Number :
50WCu,75WCu,80WCu,85WCu,90WCu
Certification :
ISO9001
Place of Origin :
CHINA
MOQ :
Negotiation
Price :
Negotiable
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
Material :
tungsten copper
Density :
15.65
CTE :
8.3
TC :
190-200
Plating :
gold
Application :
electronic packaging
Description

Tungsten-Copper (W-Cu) Electronic Packing Component Heat Sink

Description:

Copper Tungsten is one of the most popular refractory metal based heat sink materials offered today. With the new off-the-shelf system, we are able to offer standard products with a short lead-time at extremely competitive rates.

Our heat sink are composites of tungsten and copper. By adjusting the content of tungsten, we can have its coefficient of thermal expansion (CTE) designed to match those of materials such as ceramics (Al2O3, BeO), semiconductors (Si), and metals (Kovar), etc.

Advantages:

Good machinability

Good hermeticity

Good thermal conductivity

Good mechanical strength to provide excellent mechanical protection to the IC

Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.


Product Properties:

Type Composition Properties
Tungsten Content Density CTE Thermal Conductivity
W90Cu 90 ± 1 wt % 17.0 g/cm3 6.5 ppm/K 180 - 190 W/m.K
W85Cu 85 ± 1 wt % 16.3 g/cm3 7.0 ppm/K 190 - 200 W/m.K
W80Cu 80 ± 1 wt % 15.6 g/cm3 8.3 ppm/K 200 - 210 W/m.K
W75Cu 75 ± 1 wt % 14.9 g/cm3 9.0 ppm/K 220 - 230 W/m.K

Application:


These composite are widely used in applications such as Optoelectronics Packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.

Product picture:
Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink

Product tags

aluminium extruded heat sink

,

aluminium heat sink material

,

stainless steel solder flux
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Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink

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Product Detail
Brand Name :
JBNR
Model Number :
50WCu,75WCu,80WCu,85WCu,90WCu
Certification :
ISO9001
Place of Origin :
CHINA
MOQ :
Negotiation
Price :
Negotiable
Contact Supplier
Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink
Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink
Tungsten - Copper W - Cu Hermetic Packages Electronics Component Heat Sink

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
7 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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