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MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION
MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION
MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION
MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION
Specifications
Brand Name :
JBNR
Place of Origin :
CHINA
Model Number :
50MoCu,60MoCu,70MoCu,85MoCu
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
Material :
Molybdenum copper
Density :
9.8
CTE :
7
TC :
196
MOQ :
Negotiation
Price :
Negotiable
Description

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

Description:

Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable coefficient of thermal expansion and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper.Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Advantages:

1. This molybdenum copper carrier/heat sink feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper carriers are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

This composite are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

Product picture:

MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

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MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

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Product Detail
Brand Name :
JBNR
Place of Origin :
CHINA
Model Number :
50MoCu,60MoCu,70MoCu,85MoCu
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
Contact Supplier
MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION
MoCu CARRIER / HEAT SINK FOR HERMETIC PACKAGES ELECTRONICS WITH HIGH COEFFICIENT OF THERMAL EXPANSION

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
8 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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