Hermetic Packages Electronics Material S-CMC Carrier / Flange / Heat Spreader
Description:
Material | Wt% Molybdenum Content | g/cm3 Density | Thermal conductivity at25℃ | Coefficient of thermal expansion at 25℃ |
S-CMC | 5 | 9.0 | 362 | 14.8 |
10 | 9.0 | 335 | 11.8 | |
13.3 | 9.1 | 320 | 10.9 | |
20 | 9.2 | 291 | 7.4 |
Application:
S-CMC heat sink can be used in wireless communication packaging, opto electronics packaging etc.
Product picture: