CPC141 Carrier / Heat Spreader / Flange For Hermetic Packages And Microelectronic Packages
Description:
CPC is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.
Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost
4.No magnetism
Product Properties:
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 | 280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount.
Product picture:
