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Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging
Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging
Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging
Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging
Specifications
Brand Name :
JBNR
Model Number :
HCMC008
Certification :
ISO9001
Place of Origin :
China
MOQ :
Negotiation
Payment Terms :
L/C, D/A, D/P, T/T, Western Union
Supply Ability :
5 tons a month
Delivery Time :
20 days
Packaging Details :
Wooden boxes
Grade: :
Mo80Cu20, Mo75C25, Mo70Cu30, Mo60Cu40,Mo50Cu50
Surface: :
Plated or unplated
Dimensions: :
Based on customer requirements
Plating: :
Nickel plating and gold plaing
Shape: :
Shims or sheets or fabricated parts
Price :
Negotiable
Description

Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Description:

Molybdenum copper alloy is a composite material of molybdenum and copper which has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than tungsten copper. Therefore, molybdenum copper alloy is more suitable for aerospace and other fields.

Advantages:

1. This molybdenum copper base plates feature high thermal conductivity and excellent hermeticity.

2. Molybdenum copper flanges are 40% lighter than comparable tungsten copper composite.

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Application:

Molybdenum copper heat spreaders are widely used in applications such as microwave carriers, ceramic substrate carriers, laser diode mounts, optical packages, power packages, butterfly packages and crystal carriers for solid state lasers, etc.

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Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

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Product Detail
Brand Name :
JBNR
Model Number :
HCMC008
Certification :
ISO9001
Place of Origin :
China
MOQ :
Negotiation
Payment Terms :
L/C, D/A, D/P, T/T, Western Union
Contact Supplier
Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging
Chip Or Substrate Heat Dissipation Mo80Cu20 Thermal Tabs As Heat Spreader For Microelectronic Packaging

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
7 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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