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Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount
Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount
Specifications
Brand Name :
JBNR
Model Number :
50WCu,75WCu,80WCu,85WCu,90WCu
Place of Origin :
CHINA
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
MOQ :
Negotiation
Price :
Negotiable
Material :
tungsten copper
Density :
12.2
CTE :
12.5
TC :
310
Description

Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount


Description:

W-Cu heat sink material is a composite of tungsten and copper, with both tungsten low expansion characteristics, but also has copper of high thermal conductivity properties, and the tungsten and copper in the thermal expansion coefficient and thermal conductivity can be adjusted with the W-Cu composition, also the composite can be machined to various shape, these features make the application of this composite with great convenience. The thermal expansion can be adjusted to match with the following material:

(1) Ceramic materials: Al2O3(A-90,A-95,A-99),BeO(B-95, B-99),AlN,etc.;
(2) Semiconductor materials: Si, GaAs, SiGe, SiC, GaP, GaAs, AlGaAs etc.;
(3) Metal Material: Kovar alloy(4J29), 42 alloy;

Advantages:

1. High thermal conductivity
2. Excellent hermeticity
3. Excellent flatness, surface finish, and size control
4. Semi-finished or finished (Ni/Au plated) products available
5. Low void

Product Properties:

Grade W Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
90WCu 90±2% 17.0 6.5 180 (25℃) /176 (100℃)
85WCu 85±2% 16.4 7.2 190 (25℃) / 183 (100℃)
80WCu 80±2% 15.65 8.3 200 (25℃) / 197 (100℃)
75WCu 75±2% 14.9 9.0 230 (25℃) / 220 (100℃)
50WCu 50±2% 12.2 12.5 340 (25℃) / 310 (100℃)



Application:

They are extensively used as thermal mounting plates, chip carriers, tungsten copper flanges, and frames for RF, light emitting diodes and detectors, laser diode packages like pulse, single emitter, bars and complex carriers for optoelectronics amplifiers, receivers, transmitters, tunable lasers, etc.

Product picture:

Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount

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Product Detail
Brand Name :
JBNR
Model Number :
50WCu,75WCu,80WCu,85WCu,90WCu
Place of Origin :
CHINA
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
15days
Packaging Details :
as customer required
Contact Supplier
Gold Plated Tungsten Copper Heat Spreader , Microelectronic Packaging Tungsten Copper Submount

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
8 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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