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High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
Specifications
Brand Name :
JBNR
Model Number :
50MoCu,60MoCu,70MoCu,85MoCu
Certification :
ISO9001
Place of Origin :
CHINA
MOQ :
Negotiation
Price :
Negotiable
Payment Terms :
L/C, , T/T, Western Union
Delivery Time :
25days
Packaging Details :
as customer required
Material :
Molybdenum copper
Density :
9.5
CTE :
10.2
TC :
220-250
Plating :
Nickel and gold
name :
electronic packaging materials
Description

Heat Sink Molybdenum Copper Electronic Packing Material

Description:

MoCu alloy heatsink is a composite made from Mo and Cu. Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.

Advantages:

High thermal conductivity

Excellent hermeticity

Excellent flatness, surface finish, and size control

Semi-finished or finished (Ni/Au plated) products availabl

Product Properties:

Grade Mo Content Density g/cm3

Coefficient of thermal

Expansion ×10-6 (20℃)

 Thermal conductivity W/(M·K)
85MoCu 85±2% 10.0 7 160(25℃)/156(100℃)
70MoCu 70±2% 9.8 7 200(25℃)/196(100℃)
60MoCu 60±2% 9.66 7.5 222(25℃)/217(100℃)
50MoCu 50±2% 9.5 10.2 250(25℃)/220(100℃)

Application:

Our products are widely used in applications such as heat sink, heat spreader, shim, laser diode submount, substrates, base plate, flange, chip carrier, optical bench, etc.

Product picture:

High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material

Product tags

slotted aluminum extrusions

,

slotted extruded aluminum

,

slotted aluminium extrusion
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High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material

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Product Detail
Brand Name :
JBNR
Model Number :
50MoCu,60MoCu,70MoCu,85MoCu
Certification :
ISO9001
Place of Origin :
CHINA
MOQ :
Negotiation
Price :
Negotiable
Contact Supplier
High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material
High Efficiency Heat Sink Copper Molybdenum Alloy Electronic Packing Material

Zhuzhou Jiabang Refractory Metal Co., Ltd

Active Member
8 Years
hunan, zhuzhou
Since 2008
Business Type :
Manufacturer, Distributor/Wholesaler, Exporter, Trading Company, Seller
Main Products :
Hermetic Packages Electronics, Heat Sink, Welding Electrodes
Total Annual :
10,000,000-20,000,000
Employee Number :
50~100
Certification Level :
Active Member
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