CPC (Cu/Mo70Cu/Cu) Heatspreader For Mobile Base Stations / CPC For 5G Mobile Base Stations
Description:
CPC is a composite material with a laminated structure with Cu layers above and below the Cu-Mo composite material. Thermal conductivity and linear expansion coefficient can be changed by combining the composition of the core material Cu-Mo and the lamination ratio. In addition, because both surfaces are Cu, the initial heat radiation effect is excellent.
It is mainly used for wireless communications, especially amplifier substrates of mobile phone base stations.
Advantages:
1.More easily to be stamped into components than CMC
2.Very strong interface bonding which can repeatedly resist 850℃ heat shock
3.Higher thermal conductivity and lower cost
4.No magnetism
Product Properties:
Grade | Density g/cm3 | Coefficient of thermal Expansion ×10-6 (20℃) | Coefficient of thermal Expansion ×10-6 (20℃) |
CPC141 | 9.5 | 7.3 | 280(XY)/170(Z) |
CPC232 | 9.3 | 10.2 | 255(XY)/250(Z) |
Application:
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mount,mobile phone base stations.
Product picture:
