GL-25(C) Advanced Thermostable Polyimide Amber Substrate
Utilizing patented molecular architecture, our GL platform embodies a self-developed biaxially-oriented polyimide matrix with inherent amber chromatic properties. The series offers tri-tiered calibration profiles with tailored molecular configurations, purpose-formulated for elite isolation strata within sophisticated microelectronic encapsulation architectures and exacting adhesion-critical substrate implementations.
Key Advantages: Designed through cutting-edge molecular engineering, this high-performance substrate provides unparalleled structural durability, dielectric strength, and thermal endurance. Its exceptional surface compatibility guarantees faultless integration in precision assemblies, while carrying full international eco-compliance certifications (RoHS/REACH) and UL safety validation for global deployment.
Product application: Functioning as a foundational industrial component, GL-grade polyimide membrane provides critical material infrastructure for manufacturing: 1) flexible circuit protective layering systems, 2) ultra-compact interconnective components, and 3) next-generation dielectric isolation barriers. Place of Origin:
ANHUI, CHINA
Width:
514MM, 520MM, 1028MM, 1040MM.etc
Product Features
This engineered polymer demonstrates extraordinary structural performance with exceptional fracture resistance and prolonged service life, complemented by remarkable dimensional consistency derived from its near-zero thermal expansion characteristics. The substance exhibits premium interfacial bonding capabilities ensuring fail-safe component integration, while possessing validated conformance to worldwide hazardous substance restrictions (RoHS) and chemical registration protocols (REACH). Furthermore, it maintains accredited safety validation from the recognized international testing laboratory UL. Product Applications
Serving as pivotal enabling substrates for forthcoming electronics generations, GL-class polyimide matrices provide system-essential performance criteria throughout: 1) sub-micron tolerance bonded flexible circuit constructs, 2) dimensionally immutable barrier overlay configurations, 3) state-of-the-art semiconductor encapsulation ecosystems, and 4) function-engineered adhesive tape systems with customized viscoelastic profiles.
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