GL50 High-Temperature Resistant Polyimide Matrix with Inherent Spectral Filtering Properties
Leveraging proprietary macromolecular design, our Generation-Lambda technology platform integrates autogenously synthesized biaxially-aligned polyimide networks exhibiting intrinsic spectral transmission characteristics. The product ecosystem provides trichotomous performance gradations with engineered polymer morphologies, specifically architected for premium dielectric interlayers in next-generation semiconductor packaging paradigms and precision surface-bonding substrate solutions demanding nanoscale interfacial control.
Key Advantages: Engineered via pioneering nanostructural synthesis techniques, this elite-grade dielectric foundation delivers unmatched mechanical resilience, electrical insulation robustness, and extreme-temperature operational stability. The material's optimized interfacial characteristics ensure zero-defect incorporation in high-tolerance assemblies, while maintaining comprehensive global environmental regulatory approvals (EU RoHS/REACH) and internationally recognized UL safety certification for worldwide implementation.
Product application: Operating as an elemental industrial material, GL-classified polyimide diaphragms establish essential substrate infrastructure for advanced fabrication processes including: 1) pliable electronic shielding Stratum systems, 2) high-density interconnection modules, and 3) quantum-grade electrical insulation partitions. Place of Origin:
ANHUI, CHINA
Width:
514MM, 520MM, 1028MM, 1040MM.etc
Product Features
This molecularly engineered composite exhibits groundbreaking mechanical integrity with superior crack propagation resistance and extended operational longevity, augmented by exceptional dimensional invariance originating from its ultralow coefficient of thermal expansion (CTE < 5 ppm/K). The material demonstrates elite interfacial adhesion properties enabling fault-tolerant device integration, while achieving certified compliance with global hazardous materials directives (EU RoHS 3) and chemical substance registration frameworks (REACH Annex XVII). Additionally, it possesses multi-jurisdictional safety accreditation from the International Electrotechnical Commission (IEC) and Underwriters Laboratories certification for cross-border deployment. Product Applications
Acting as critical facilitation platforms for next-wave electronic applications, Generation-Leadership specification polyimide composites deliver architecture-vital performance benchmarks across: 1) sub-micrometer precision laminated flex-circuit assemblies, 2) geometrically stable protective interface matrices, 3) vanguard chip-scale integration environments, and 4) application-optimized bonding films with tunable rheological properties.
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