GL-12.5 High- Polyimide Polyimide Yellow Film
Developed through proprietary technology, the GL film series represents our autonomously engineered biaxially-stretched polyimide material in intrinsic amber coloration. This product line features three specialized gauge variants with customized material compositions, specifically engineered for high-performance dielectric layers in advanced encapsulation systems and precision bonding substrate applications.
Key Advantages: Designed through cutting-edge molecular engineering, this high-performance substrate provides unparalleled structural durability, dielectric strength, and thermal endurance. Its exceptional surface compatibility guarantees faultless integration in precision assemblies, while carrying full international eco-compliance certifications (RoHS/REACH) and UL safety validation for global deployment.
Product application: Functioning as a foundational industrial component, GL-grade polyimide membrane provides critical material infrastructure for manufacturing: 1) flexible circuit protective layering systems, 2) ultra-compact interconnective components, and 3) next-generation dielectric isolation barriers. Place of Origin:
ANHUI, CHINA
Width:
514MM, 520MM, 1028MM, 1040MM.etc
Product Features
This engineered polymer demonstrates extraordinary structural performance with exceptional fracture resistance and prolonged service life, complemented by remarkable dimensional consistency derived from its near-zero thermal expansion characteristics. The substance exhibits premium interfacial bonding capabilities ensuring fail-safe component integration, while possessing validated conformance to worldwide hazardous substance restrictions (RoHS) and chemical registration protocols (REACH). Furthermore, it maintains accredited safety validation from the recognized international testing laboratory UL. Product Applications
As a cornerstone engineering material for next-gen electronic systems, GL-specification polyimide substrates deliver mission-critical operational parameters across: 1) micron-precision adhesive flexible copper-clad laminate architectures, 2) thermally invariant protective overlay systems, 3) cutting-edge chip-scale encapsulation platforms, and 4) application-specific pressure-sensitive tape formulations.
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