Low-Dielectric Polyimide Film (Low-Dk PI Film) is an advanced polymer material engineered to exhibit *ultra-low dielectric constant (Dk < 3.0)* and minimal dielectric loss (Df < 0.005) across high-frequency ranges (1 MHz–100 GHz). It retains the intrinsic thermal stability (>300°C) and mechanical robustness of polyimide while addressing signal integrity demands in high-speed electronics.