Product Features

Utilizing a groundbreaking nano-composite reinforcement technology, this advanced material achieves a 45% enhancement in mechanical strength over industry benchmarks, establishing new parameters for structural resilience in flexible electronics. Its meta-stable thermal architecture delivers a near-zero CTE (Coefficient of Thermal Expansion)—measured at 50% below conventional polyimide films—ensuring micron-level dimensional accuracy across 10,000+ thermal cycles. Through our plasma-graft surface functionalization process, the material achieves 60% improved adhesive bonding strength without primers. With full compliance to RoHS 3, REACH SVHC, and IEC 61249-2-21 halogen-free standards, along with UL 94V-0 certification and ISO 18240 aerospace qualification, it meets the most stringent global performance and safety requirements for next-generation applications.

Product Applications

As a foundational material platform for future electronics, the GL series engineered polyimide film enables technological breakthroughs across four advanced domains: ultra-thin high-frequency FCCL for 5G/6G millimeter-wave circuits, dimensionally invariant precision coverlays for aerospace instrumentation, ultra-reliable chip-on-flex and 2.5D/3D heterogenous integration packaging, and engineered tape substrates with customized adhesion profiles for extreme-environment industrial assemblies.

Why Choose Our Factory?

By integrating our proprietary manufacturing process with your product development cycle, we deliver tailored polyimide solutions that achieve 25%+ cost efficiency through precision-engineered thicknesses (5-200μm), customized widths (±0.1mm tolerance), and functionalized surface treatments—including anti-glare matte, optical-grade glossy, and E-shield metallic finishes. Our zero-defect production protocol ensures material consistency across batches while cutting prototyping lead times by 40%. Volume-based tier pricing unlocks further savings for aerospace, automotive, and advanced display applications. Begin your partnership with a performance-validated trial kit and dedicated technical account management.

Material Preservation Protocol
To ensure the operational integrity and extended lifecycle of our engineered polyimide films, compliance with the following preservation guidelines is mandatory:

Stability Assurance Period:
Full material specifications are maintained for 12 months from manufacture when stored in designated conditions.

Environmental Controls:

• Thermal & Humidity Management: Climate-controlled storage at 18-23°C with relative humidity below 50% is required

• Photo-degradation Prevention: Material must be shielded from all UV and intense visible light sources

• Atmospheric Integrity: Storage areas must be free from acidic/alkaline vapors, ozone, and organic solvents

Handling Procedures:

• Use static-dissipative, lint-free gloves in ISO Class 7 or cleaner environments

• Original barrier packaging with integrated desiccant must remain sealed until use

• After partial use, reseal immediately using vacuum-compatible barrier bags with fresh desiccant

Verification:
Material certification includes 36-month accelerated aging validation per IEC 60068-2-78