Our next-generation GL-25(C) substrate incorporates patented quantum dot reinforcement and multi-axial molecular alignment technology, delivering 45% superior thermal stability and 50% enhanced dielectric performance versus conventional polyimide films. This self-developed platform features quad-tiered molecular calibration with precision-engineered polymer chains, specifically designed for mission-critical microelectronic encapsulation and high-reliability substrate applications requiring absolute performance assurance.
UL 94 V-0 certification with GWIT 960°C rating
NASA-grade outgassing certification (<0.1% CVCM)
Full compliance with RoHS 3, REACH SVHC, and ISO 18240 standards
FDA compliance for food contact applications
The GL-25(C) represents a paradigm shift in polyimide technology by integrating quantum reinforcement particles with precisely aligned polymer chains. This creates a three-dimensional reinforcement network that eliminates traditional trade-offs between thermal stability, mechanical strength, and electrical performance. Unlike conventional substrates, our technology enables simultaneous improvement in all critical performance parameters while maintaining exceptional processing characteristics for next-generation electronic applications.
Advanced Semiconductor Packaging
2.5D/3D interposers and heterogenous integration substrates
Ultra-fine pitch RDL layers for chiplet architectures
High-Reliability Flexible Electronics
Foldable display cover substrates and sensor membranes
Aerospace-grade flexible hybrid circuits
Precision Industrial Systems
High-temperature motor insulation systems
Electric vehicle battery encapsulation barriers
Medical Device Technology
Implantable medical device encapsulation
Sterilization-resistant surgical instrument insulation