Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
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2 Years
guangdong, foshan
Since 2018
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Panel Level Packaging Form

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Panel Level Packaging Chip

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Panel Level Packaging Product Structure

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Fan Out Panel Level Packaging

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TGV Through Glass Via

 (7)

Packaging Simulation Experiments

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Quality Control

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Certification

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd. Certifications
Standard: ISOO9001
Number: 01222Q30043R0S
Issue Date: 2022-01-13
Expiry Date: 2025-01-12
Scope/Range: panel level packaging and glass substratete chnology research
Issued By: Guangzhou Ceprei certification center services Limited All Rights Reserved
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