Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Verified Supplier
2 Years
guangdong, foshan
Since 2018
Menu
Menu
Supplier homepage
Product categories
Show all products
Panel Level Packaging Form
Panel Level Packaging Chip
Panel Level Packaging Product Structure
Fan Out Panel Level Packaging
TGV Through Glass Via
Packaging Simulation Experiments
Company profile
Quality control
Contact us
Supplier Homepage > Products

PRODUCT CATEGORIES

Panel Level Packaging Form

 (3)

Panel Level Packaging Chip

 (4)

Panel Level Packaging Product Structure

 (4)

Fan Out Panel Level Packaging

 (5)

TGV Through Glass Via

 (7)

Packaging Simulation Experiments

 (1)

Contact Information

Basic Information

Contact Person: LIN TINGYU
Company Name: Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Company Location: Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
Factory Location: Room A208,Science rearch Building,Building A of Foshan high-tech think tank center, nanhai software science park,Shishan Town,Nanhai District,Foshan city,Guangdong Province
Employee Number: 101~120
Business Type: Manufacturer
Brands: FZX
Website: https://www.fozhixinsmc.com/

Some recommendations for you

310*320mm Panel Size Panel Level QFN Low Electrical Resistance
Panel Level Packaging Form

310*320mm Panel Size Panel Level QFN Low Electrical Resistance
Contact Now
0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter
Panel Level Packaging Form

0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter
Brand Name：FZX Fanout Process and Product
Place of Origin：PR China
Contact Now
Panel Level Packaging Panel Level SiP Used In Various Industries
Panel Level Packaging Form

Panel Level Packaging Panel Level SiP Used In Various Industries
Model：SiP
Brand Name：FZX Fanout Process and Product
Contact Now
310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption
Panel Level Packaging Chip

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption
Model：Multi-chip MOSFET
MOQ：3000pcs
Contact Now
LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm
Panel Level Packaging Chip

LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm
Model：LED chip（Silicon）
MOQ：3000pcs
Contact Now
Contact Supplier
Submit Requirement