Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Verified Supplier
3 Years
guangdong, foshan
Since 2018
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Panel Level Packaging Form
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Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd.
Business Type： Manufacturer
Main Products：

Panel Level Packaging Form

,  

Panel Level Packaging Chip

,  

Panel Level Packaging Product Structure
Total Annual： 10000000-50000000
Employee Number： 101~120
Certification Level： Verified Supplier
Guangdong Fozhixin (FZX）microelectronic technology research Pte Ltd was registered in Foshan city, Guangdong province of PRC, 2018. FZX was focus on panel level packaging technology development and mass production. At present, FZX has a factory which was about more than 2000 meter square. In addition, there is another mass production site being built up with more than 5000 meter square in Foshan city as well. MOS chip package, GaN package and LED/driver one package, etc. are major products that are shipped to the final customers. FZX also delivered the glass core substrate to the...
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Panel Level Packaging Form

Panel Level Packaging Form

3 products available

310*320mm Panel Size Panel Level QFN Low Electrical Resistance

0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter

Panel Level Packaging Panel Level SiP Used In Various Industries
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Panel Level Packaging Chip

Panel Level Packaging Chip

4 products available

310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption

LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm

310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
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Panel Level Packaging Product Structure

Panel Level Packaging Product Structure

4 products available

Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump

Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball
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Fan Out Panel Level Packaging

Fan Out Panel Level Packaging

5 products available

310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product

310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)

310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
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TGV Through Glass Via

TGV Through Glass Via

7 products available

high aspect ratio TGV Foundary Capabilities for semiconductor packaging

High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips

High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm
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Packaging Simulation Experiments

Packaging Simulation Experiments

1 products available

Package Suitable For Various Packaging Simulation Experiments
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